Our Journey

ASUNX is a high-tech company incubated by Anhui University. More than just a technology-led and innovation-driven enterprise, it is one that continuously breaks through its own limits and transforms itself in the fiercely competitive market. The company boasts a united and innovative R&D team. Leveraging prestigious academic research platforms—such as the Anhui Provincial Engineering Research Center for Advanced Power Electronics and Energy Conversion, the Doctoral Program in Electrical Engineering (a Level-I discipline) at Anhui University, the National-Local Joint Engineering Laboratory of High-Efficiency Motor and Control Technology, and the Ministry of Education's Engineering Research Center for Power Quality—ASUNX focuses on the R&D and application of intelligent drive technologies for third-generation wide-bandgap power semiconductors.

I. Founding & Technological Positioning

• Background: Incorporated in August 2021 in the Hefei High-Tech Zone and incubated by Anhui University, ASUNX leverages premier academic platforms such as the university's Doctoral Program in Electrical Engineering and the National-Local Joint Engineering Laboratory. The company focuses on the R&D of intelligent drive technologies for third-generation semiconductors (SiC/GaN).

• Core Team: Our R&D team is led by internationally renowned power electronics experts, comprising professors, doctoral supervisors, and industry veterans. We maintain close collaboration with leading global research institutions, including Aston University (UK) and the University of Southern Queensland (Australia). 

1. Product Portfolio Development:

• We have launched a core product matrix including IGBT/SiC/GaN intelligent drive modules, solid-state relays, and power electronic converters, serving sectors like new energy vehicles, energy storage systems, aerospace, and more.

• Our lithium battery UPS (Uninterruptible Power Supply) and PCS (Power Conversion System) technologies have passed extreme environment tests (e.g., Antarctica, Tibetan Plateau) and have been exported to international markets including France and Turkey.

2. Technical Certifications & Awards:

• Our silicon carbide drive technology was awarded the Gold Medal at the 48th International Exhibition of Inventions of Geneva.

• Products have obtained international certifications such as CE, UL, and TLC, alongside ISO 9001, ISO 14001, and ISO 45001 management system certifications, underscoring our commitment to quality control.

III. Market Expansion & Ecosystem Collaboration

• Industry-Academia-Research Collaboration: We partner with Tsinghua University and PV industry leaders to co-develop power control equipment and have secured projects such as Tsinghua's wind converter system testing platform.

• Deepening Industry Applications: Our products are deployed in high-end applications including defense equipment, nuclear power instrumentation control, and semiconductor manufacturing equipment, providing solutions for electric vessels and high-temperature industrial processes.

• Globalization Strategy: We promote import substitution through overseas partnerships, ensuring our technology's compatibility with and validation against imported components.

IV. Qualification Upgrades & Honors

• Accreditations: Recognized as a National High-Tech Enterprise, Anhui Innovative SME, and a key enterprise in Hefei's integrated circuit industry chain. Our products are listed in the National Patent-Intensive Product Catalog.

• Intellectual Property: We hold 12 invention patents, 10 software copyrights, 4 design patents, and 7 utility model patents.

• Scale & Infrastructure: Our team has grown to 50-99 employees. We have established advanced laboratories and modern office facilities, offering equity incentives and international training programs.

V. Strategic Upgrade & Future Roadmap

• Technology Focus: Deepen expertise in "power control + green energy storage," enhancing the application of SiC/GaN devices in high-temperature and high-power scenarios.

• Service Expansion: Target critical national equipment and defense needs, driving the autonomy and controllability of semiconductor technology.

• Capacity & R&D Investment: Continue expansion at our Phase II base in the Hefei Innovation Industrial Park, with recruitment focused on hardware R&D and international sales teams.

• Deep Integration: Capitalizing on both national policy support and market demand, we aim to achieve further breakthroughs across multiple fields. By introducing new materials, architectures, and advanced packaging technologies, we will continuously enhance chip performance and overcome technical bottlenecks.